? semiconductor components industries, llc, 2016 1 publication order number : july 2016 - rev. p1 LC898124EP1XC/d www.onsemi.com this document contains information on a new product. specifications and information herein are subject to change without notice. ordering information see detailed ordering and shipping info rmation on page 10 of this data sheet. LC898124EP1XC advance information optical image stabilization (ois) / open-auto focus (af) controller & driver integrating an on-chip 32-bit dsp over view LC898124EP1XC is a system lsi integrating an on-chip 32-bit dsp, a eeprom and peripherals including analog circuits for optical image stabilization (ois) / auto focus (af) control and constant current drivers. features ? on-chip 32-bit dsp ? built-in software for digital servo filter ? built-in software for gyro filter ? memory ? eeprom ? rom ? sram ? peripherals ? ad converter : input 4 ch ? da converter : output 2 ch ? 2-wire serial i/f circuit (with clock stretch function) ? hall bias circuit x2 ch ? hall amp x2 ch ? osc (oscillator) ? ldo (low drop-out regulator) ? digital gyro i/f for various types of gyro (spi bus) ? interrupt i/f ? driver ? ois constant current linear driver (x2 ch, i full = 160 ma) ? op-af(bidirection) constant current linear driver (x1 ch, i full = 130 ma) ? package ? wlcsp27 (3.89 mm x 1.30 mm), thick ness max. 0.33 mm, with back coat ? pb-free and halogen free compliance ? power supply voltage ? ad/da/vga/ldo/osc : avdd30 = 2.6 v to 3.3 v ? driver : vm = 2.6 v to 3.3 v wlcsp27, 3.89x1.30, 0.4p
LC898124EP1XC www.onsemi.com 2 block diagram mon1 sw0 sw2 ain0 ain1 ain2 ain3 sw3 sw4 mon2 adc dac opinpy opinmy opinpx opinmx hlybo hlxbo dac ctrl adc ctrl system ctrl work ram: dma0 work ram: dmb program rom dma0 dmb dmio data prog ram lpdsp32 spi (master) (d-gyro i/f) current linear ctrl e2prom i/f eeprom h-bridge driver osc clock divider scl sda sda scl scl2(nc) sda2(nc) dgssb dgsclk dgdata eirq out1 out2 out3 out4 out5 out6 vm pgnd por ldo avdd30 avss host cpu (master) digital gy ro (slave) hall x hall y port i2c (slave) dac ldopo(dvdd15) program ram int sw1 cmos sensor 1.8v work ram: dma1 dma1 mon1 iout0 iout1 ao ut0 ao ut1 ldo
LC898124EP1XC www.onsemi.com 3 application diagram package dimensions unit : mm lens vcm hall sensor LC898124EP1XC eeprom digital gyro i c spi ois/op-af actuator camera module cmos sensor ap/isp position (ois) digital gyro ois/af driver 2 wlcsp27, 3.89x1.30, 0.4p case 567nj issue o seating plane 0.05 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to spherical crowns of solder balls. 2x dim a min max millimeters d 3.89 bsc e b 0.12 0.22 e 0.40 bsc 0.33 d e a b pin a1 reference e a 0.05 b c 0.03 c 0.08 c 27x b 4 c b a 0.13 c a1 c 1.30 bsc 0.17 27x dimensions: millimeters *for additional information on our pb-free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.40 0.40 0.05 c 2x top view side view bottom view note 3 e recommended package outline 123 pitch pitch a1 a detail a die coat detail a 567 89 a1 0.04 ref
LC898124EP1XC www.onsemi.com 4 pin assign bottom view 6789 mon1 scl2 scl dgssb 12345 hlybo sda2 sda dgsclk a out5 out6 avss avdd30 ldpo hlxbo mon2 eirq dgdata b vm pgnd opinpy opinmy opinmx c out4 out3 out2 out1 opinpx internal vdd output 1.8 v i/o driver vdd/vss
LC898124EP1XC www.onsemi.com 5 pin description no. pin i/o i/o spec primary fu nction sub functions init 1 mon1 b servo monitor analog in/out 2-wire serial data z interrupt input 2 mon2 b servo monitor analog in/out 2-wire serial clock z 3 scl b od 2-wire serial host i/f clock slave z 4 sda b od 2-wire serial host i/f data slave z 5 sda2 b nc z 6 scl2 b nc z 7 dgssb b digital gyro data i/f chip select out (3/4 -wire master) 3/4-wie i/f chip select in (read only) z 8 dgsclk b digital gyro data i/f clock out (3/4-wire master) 3/4-wire i/f clock in (read only) z 9 eirq b od interrupt input digital gyro data i/f data in (4-wire master) z 10 dgdata b digital gyro data i/f data (3-wire master) digital gyro data i/f data out (4-wire master) z 3/4-wire i/f data in (read only) 11 hlxbo o ois hall x bias output z 12 hlybo o ois hall y bias output z 13 opinmx i ois hall x opamp input minus z 14 opinpx i ois hall x opamp input plus - 15 opinmy i ois hall y opamp input minus - 16 opinpy i ois hall y opamp input plus - 17 out1 o ois driver output z 18 out2 o ois driver output z 19 out3 o ois driver output z 20 out4 o ois driver output z 21 out5 o open-af driver output z 22 out6 o open-af driver output z 23 avdd30 p analog power (2.6 v to 3.3 v) - 24 avss p analog gnd - 25 vm p driver power (2.6 v to 3.3 v) - 26 pgnd p driver gnd 27 ldpo p internal ldo power output
LC898124EP1XC www.onsemi.com 6 electrical characteristics absolute maximum rating at avss = 0 v, pgnd = 0 v (note 1) *1:dgssb, dgsclk, dgdata, eirq note 1 : stresses exceeding those listed in the maximum rati ngs table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. allowable operating ratings at ta = ? 30 to 85 ? c, avss = 0 v, pgnd = 0 v (note 2) 3.0v power supply (avdd30) parameter symbol min typ max unit power supply voltage v ad 30 2.6 2.8 3.3 v input voltage range v ina 0 - v ad 30 v 3.0v power supply (vm) parameter symbol min typ max unit power supply voltage v m 30 2.6 2.8 3.3 v input voltage range v inm 0 - v m 30 v note 2 : functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresses beyond the recommended operati ng ranges limits may affect device reliability. d.c. characteristics [input/output] at ta = ? 30 to 85 ? c, avss = 0 v, pgnd = 0 v, avdd 30 = 2.6 to 3.3 v (note 3) parameter symbol conditions min typ max unit applicable pins high-level input voltage vih cmos schmitt 1.26 v dgssb,dgsclk dgdata,eirq low-level input voltage vil 0.4 v high-level input voltage vih cmos schmitt 1.4 v scl,sda low-level input voltage vil 0..4 v high-level input voltage vih cmos schmitt 0.75av dd30 v mon1,mon2, low-level input voltage vil 0.25avdd30 v high-level output voltage voh ioh = ? 1 ma 1.51 1.89 v dgssb,dgsclk dgdata low-level output voltage vol iol = 1 ma 0.2 v dgssb,dgsclk dgdata,eirq high-level output voltage voh ioh = ? 2 ma avdd 30-0.3 v mon1,mon2 low-level output voltage vol iol = 2 ma 0.3 v low-level output voltage vol iol = 2 ma 0.2 v scl,sda, analog input voltage vai avss avdd 30 v mon1,mon2 pull up resistor rup 50 250 k ? dgssb,dgsclk dgdata mon1,mon2 pull down resistor rdn 50 220 k ? dgssb,dgsclk dgdata,eirq mon1,mon2 note 3 : product parametric performance is indicated in the electrical characterist ics for the listed test conditions, unless o therwise noted. product performance may not be indicated by the elec trical characteristics if oper ated under different conditions. parameter symbol conditions ratings unit power supply voltage v ad 30 max ta ? 25 ? c ? 0.3 to +4.6 v vm max ta ? 25 ? c ? 0.3 to +4.6 v input / output voltage v ai 30,v ao 30 ta ? 25 ? c ? 0.3 to v ad 30+0.3 v v mi 30,v mo 30 ta ? 25 ? c ? 0.3 to v m 30+0.3 v input voltage v18*1 ta ? 25 ? c ? 0.3 to +1.98 v storage temperature tstg ? 55 to +125 ? c operating temperature topr1 read for eeprom ? 30 to +85 ? c topr2 program &erase for eeprom ? 30 to +70 ? c
LC898124EP1XC www.onsemi.com 7 driver output at ta = 25 ? c, vss = 0 v, pgnd = 0 v, avdd = vm = 2.8 v parameter symbol condit ion min typ max unit output current out1 to out4 ifull full code 160 ma output current out5, out6 full code op-af (bidirection) 130 ma non-volatile memory characteristics item symbol condition min typ max unit applicable circuit endurance en 1000 cycles eeprom data retention rt 10 years write time twt 20 ms
LC898124EP1XC www.onsemi.com 8 ac characteristics power sequence avdd30 vm tr vbot 10 % 2.6v toff item symbol min typ max units rise time tr 3 ms wait time tw 100 ms botom voltage vbot 0.2 v injection order between avdd30 and vm is below. sda, scl tolerate 3v input at the time of power off. the data in the eeprom may be rewritten unintent ionally if you do not keep specifications. and it is forbidden to power off during eeprom access. the data in the eeprom may be rewritten unintentionally. avdd30 vm tvmrd tavfd vm avdd + 0.5v (vm 3.3v) 2.6v 2.6v tvmrd > 0ms tavfd > 0ms ? ?
LC898124EP1XC www.onsemi.com 9 2-wire serial interface timing the communication protocol is compatible with i 2 c (fast mode plus). this circuit has clock stretch function. item symbol pin name min typ max units scl clock frequency fscl scl 1000 khz start condition hold time thd,sta scl sda 0.26 ? s scl clock low period tlow scl 0.5 ? s scl clock high period thigh scl 0.26 ? s setup time for repetition start condition tsu,sta scl sda 0.26 ? s data hold time thd,dat scl sda 0 (*1) 0.9 ? s data setup time tsu,dat scl sda 50 ns sda, scl rising time tr scl sda 120 ns sda, scl falling time tf scl sda 120 ns stop condition setup time tsu,sto scl sda 0.26 ? s bus free time between stop and start tbuf scl sda 0.5 ? s (*1) although the i 2 c specification defines a condition that 300 ns of hold time is required internally, this lsi is designed for a condition with typ. 40 ns of hold time. if sda signal is unstable around falling point of scl signal, please implement an appr opriate treatment on board, such as inserting a resistor. sda scl
LC898124EP1XC www.onsemi.com 10 on semiconductor and the on semiconductor logo are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries in the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and othe r intellectual property. a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent-marking.pdf .on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does on semiconductor assume any liability arising out of the app lication or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, regulations and safety require ments or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the rights of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life sup port systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended fo r implantation in the human body. should buyer purchase or use on semiconductor products for any such unintended or unauthorized application, buyer sh all indemnify and hold on semic onductor and its officers, employees, subsidiaries, affilia tes, and distributors harmles s against all cl aims, costs, d amages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resal e in any manner. ordering information device package shipping (qty / packing) LC898124EP1XC-mh wlcsp27, 3.89x1.30, 0.4p (pb-free / halogen free) 4000 / tape & reel ? for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. ht tp://www.onsemi.com/pub_lin k/collateral/brd8011-d.pdf development product sample is a product that intend to verify whether it is matched the custom er's application spec. we kindly ask you to evaluate surely and enough prior mass-production. please contact our sales, if there are any problems.
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